| AIS |
Adhesive Interconnect System |
| AOI |
Automatic Optical Inspection |
| AOQ |
Average Outgoing Quality |
| AQL |
Acceptable Quality Level |
| ASIC |
Application Specific Integrated Circuit |
| ATE |
Automatic Test Equipment |
| AXI |
Automated X-Ray Inspection |
| BGA |
Ball Grid Array |
| BLP |
Bottom Leaded Packages |
| BTAB |
Bumped Tape Automated Bonding |
| C4 |
Controlled Collapse Chip Connect |
| C5 |
Controlled Collapse Chip Carrier Connection |
| CAD |
Computer Aided Design |
| CAM |
Computer Aided Manufacturing |
| CAR |
Computer Aided Repair |
| CBGA |
Ceramic Ball Grid Array |
| CCA |
Circuit Card Assembly |
| CCGA |
Ceramic Column Grid Array |
| CDR |
Convection Dominant Reflow |
| CFM |
Continuous Flow Manufacturing |
| CGA |
Column Grid Array |
| CIM |
Computer Integrated Manufacturing |
| C/IR |
Convection/Infrared |
| CIS |
Condensation Inert Soldering |
| COB |
Chip on Board |
| COC |
Certificate Of Compliance |
| COF |
Chip On Flex |
| CP |
Capability Performance |
| CPI |
Continuous Process Improvement |
| CSP |
Chip Scale Package |
| DCA |
Direct Chip Attachment |
| DFA |
Design For Assembly |
| DFM |
Design For Manufacturability |
| DFX |
Design For Excellence |
| DOE |
Design Of Experiments |
| DPM |
Defects Per Million |
| ECN |
Engineering Change Notice |
| ECO |
Engineering Change Order |
| EDA |
Electronic Design Automation |
| EIS |
Engineering Information System |
| EMPA |
Electronic Manufacturing Process Audit |
| EMPC |
Electronic Manufacturing Process Certification |
| EMS |
Electronic Manufacturing Services |
| ESD |
Electrostatic Discharge |
| ESS |
Environmental Stress Screening |
| FAC |
Forced Air Convection |
| FCIP |
Flip Chip In Package |
| FCC |
Flat Conductor Cable |
| FEA |
Finite Element Analysis |
| FLT |
Full Liquidus Temperature |
| FOP |
Fineness of Print (Stencil) |
| FPT |
Fine Pitch Technology |
| HAL |
Hot Air Leveling |
| HALT |
Highly Accredited Life Testing |
| HASL |
Hot Air Solder Leveling |
| IC |
Integrated Circuit |
| ICT |
In-Circuit Test |
| ILB |
Inner Lead Bonding |
| IMC |
Intermetallic Compound |
| IR |
Infrared |
| JEDEC |
Joint Electronic Device Engineering Council |
| JIT |
Just In Time |
| KGB |
Known Good Board |
| KGD |
Known Good Die |
| LCCC |
Leadless Ceramic Chip Carrier |
| LDT |
Liquidus Dwell Time |
| LFEA |
Lead-Free Electronic Assembly |
| LGA |
Land Grid Array |
| LOC |
Lead On Chip |
| LSI |
Large Scale Integration |
| MCM |
Multi Chip Module |
| MELF |
Metal Electrode Leadless Face |
| MCT |
Machine Capability Testing |
| MLB |
Multi-Layer Board |
| MLPWB |
Multi-Layer Printed Wiring Board |
| MRP |
Material Requirement Planning |
| MSD |
Moisture Sensitive Device |
| NEMA |
National Electronics Manufacturers Association |
| NEMI |
National Electronics Manufacturing Initiative |
| NPI |
New Product Introduction |
| OA |
Organic Acid |
| OE |
Opto Electronic |
| OLB |
Outer Lead Bonding |
| OMPAC |
Over Molded Pad Array Carrier |
| P/I |
Packaging And Interconnection |
| PAC |
Pad Array Carrier |
| PBGA |
Plastic Ball Grid Array |
| PCB |
Printed Circuit Board |
| PCBA |
Printed Circuit Board Assembly |
| PCGA |
Plastic Column Grid Array |
| PCMCIA |
Personal Computer Memory Card Intl Association |
| PGA |
Pin Grid Array |
| PLCC |
Plastic Leaded Chip Carrier |
| PNP |
Pick And Place |
| PTH |
Pin Through Hole |
| PWB |
Printed Wiring Board |
| PWI |
Process Window Index |
| QFP |
Quad Flat Pack |
| QTA |
Quick Turn Around |
| RA |
Rosin Fully Activated |
| RMA |
Rosin Mildly Activated |
| ROSE |
Resistivity of Solvent Extraction |
| SCRS |
Single Center Reflow Soldering |
| SIR |
Surface Insulation Resistance |
| SMA |
Surface Mount Assembly |
| SMART |
Surface Mount And Related Technology |
| SMC |
Surface Mount Component |
| SMD |
Surface Mount Device |
| SMOBC |
Solder Mask Over Bare Copper |
| SMT |
Surface Mount Technology |
| SMTA |
Surface Mount Technology Association |
| SOIC |
Small Outline Integrated Circuit |
| SOT |
Small Outline Transistor |
| SPC |
Statistical Process Control |
| SPRS |
Single Pass Reflow Soldering |
| TAB |
Tape Automated Bonding |
| TBGA |
Tape Ball Grid Array |
| Tg |
Glass Transistion Temperature |
| THT |
Through-Hole Technology |
| TQM |
Total Quality Management |
| TSOP |
Thin Small Outline Package |
| TSSOP |
Think Shrink Small Outline Package |
| UFPT |
Ultra Fine Pitch Technology |
| ULR |
Ultra Low Residue |
| WI |
Wetability Index |
| WLP |
Wafer Level Packaging |
| WSI |
Wafer Scale Integration |
| ZAF |
Z-Axis Adhesive Film |
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